Bond tester，Lead welding strength test after microelectronic lead bonding, joint and substrate surface bonding test, repetitive thrust fatigue test of welding ball (internal lead pull test, micro solder joint thrust test, golden ball thrust test, chip shear force test, SMT welding components thrust test, BGA matrix overall thrust test). The equipment is widely used in semiconductor packaging, LED packaging, smart card packaging, communication electronics, automotive electronics industry and various research institutes, colleges and universities, electronic circuit failure analysis and testing。

Test Item：

Technical specification：

1, tensile test commonly used range selection: 100g,1kg, 5kg,20kg,50kg,100kg, test accuracy 0.1%; (OOther ranges customizable)

2, thrust test commonly used range selection: 250g,5Kg,100kg, 200kg, 500kg test accuracy 0.1%; (Other ranges customizable)

3, the software can support: pressure test, thrust fatigue test, chip height measurement, line arc height measurement;

4, X axis: effective stroke 100mm, maximum speed 5 mm/s, resolution 0.1μm;

5, Y-axis: effective stroke 100mm, maximum speed 5 mm/s, resolution 0.1μm;

6, Z axis: effective stroke 100mm, maximum speed 7mm/s, resolution 0.1μm;

7, Z-axis test minimum positioning height: ≤0.5μm;

8, platform fixture: platform can share a variety of fixtures, fixtures can rotate 360 degrees;

9, four-axis movement platform, using imported transmission parts to ensure high-speed, long-term and stable operation of the machine;

10, the machine comes with computer windows operating system, software operation is simple, can display test data and force distribution curve;

11, microscope :1~60 times;

12, compressed air: 4.5~6Bar;

13, vacuum supply: 550mm Hg

14, dimensions: width W430mm* depth D665mm* height H790mm;

15, weight: 95KG;

16, power supply: 220V±5%, 50-60HZ;

17,Power: 1KW/4.5A;

Sofeware screen：

Test fixture：